UPMSP Vocational Mobile Repairing flashcards
UPMSP Vocational Mobile Repairing · Build recall with a focused review session.
32 cards. Read the term and the definition here. The deck at the top of this page is optional.
- Ohm's Law
- The relationship V = I × R, where V is voltage in volts, I is current in amperes, and R is resistance in ohms. Used to calculate expected current or resistance in a circuit.
- Power Formula
- Electrical power P = V × I, also written P = I²R or P = V²/R. It tells how much energy per second a component dissipates, which helps spot overloaded parts.
- Diode Mode Test
- A multimeter function that applies a small forward voltage and displays the drop. A silicon junction reads about 0.6–0.7 V; near-zero indicates a short, OL indicates an open.
- Parallel Resistance
- For resistors in parallel, 1/R = 1/R1 + 1/R2 + ... The equivalent resistance is always lower than the smallest individual resistor. Two equal resistors give half the value.
- PMIC
- Power Management Integrated Circuit. It converts battery voltage into the multiple regulated rails (buck and LDO outputs) that supply the SoC, memory, display, and radio sections of a phone.
- eMMC and UFS
- Embedded flash storage standards used for phone firmware and user data. eMMC is the older standard; UFS is faster and used in modern devices. Both can fail as hardware or as corrupted partitions.
- RF Front-End Module
- The block between the antenna and the transceiver, containing switches, filters, and often the power amplifier. It routes the correct band to the radio and is a common cause of single-band signal faults.
- Board-to-Board Connector
- A multi-pin connector joining two PCBs or a board to a flex. Bent or corroded pins cause no-display, no-charge, or no-boot symptoms depending on which pin group is damaged.
- Screw Mapping
- The practice of recording each screw's position during disassembly. Screws vary in length, and a long screw in a short hole can puncture the board or battery.
- Adhesive Softening
- Heating the frame to roughly 60–80 °C softens the adhesive holding the display or back cover. Excessive heat damages OLED panels and lithium cells, so temperature must be controlled.
- Battery Connector First
- A disassembly rule: disconnect the battery connector before handling other connectors, and reconnect it last. This prevents short circuits while flexes and boards are moved.
- Current Draw Signature
- The pattern of current a board draws from a DC supply. Near-zero suggests an open circuit, high steady current a short, and pulsing current a boot loop. Compare with a known-good board.
- Thermal Fault Location
- Using a thermal camera or isopropyl alcohol evaporation to find a shorted component. The warm part, or the spot where alcohol dries fastest, is the likely fault.
- Substitution Testing
- Swapping a suspected part for a known-good one, such as a battery, screen, or flex, to quickly decide whether the fault lies in the device or the accessory.
- Cold Solder Joint
- A dull, ball-shaped joint that did not wet properly, usually from insufficient heat or flux. It causes intermittent connections and must be reflowed with fresh flux.
- Reflow Temperature
- The peak temperature a board or component can withstand during soldering. Lead-free SAC305 melts near 217–220 °C; exceeding a datasheet limit deforms connectors and damages parts.
- Hot Air Rework
- A technique using heated airflow to melt solder around a component. Preheat the board, direct airflow around the part, and lift only after the solder is fully liquid.
- BGA Reballing
- Replacing the solder balls under a ball-grid-array package using a stencil, correct-diameter balls, flux, and a reflow profile. Misalignment causes hidden bridges under the package.
- EDL Mode
- Emergency Download mode on Qualcomm chipsets. It allows low-level flashing through a signed programmer and Firehose loader, and is used to recover devices that will not boot normally.
- Fastboot
- A bootloader protocol used to flash partitions, unlock bootloaders, and recover devices. It requires the correct image for the exact model and build; a mismatch can brick the phone.
- Firmware Mismatch
- Flashing an image built for a different model or region. Symptoms include boot loops, missing baseband, and failed network registration, and recovery usually needs a full correct flash.
- Signal Strength dBm
- A logarithmic measure of received power. Values closer to zero are stronger: about −50 to −70 dBm is excellent, −90 to −100 dBm weak, and below −110 dBm marginal.
- SINR
- Signal-to-Interference-plus-Noise Ratio. It measures signal quality rather than raw strength; high strength with poor SINR usually indicates interference rather than distance from the tower.
- APN Settings
- Access Point Name configuration that tells the phone how to reach the carrier's data network. A wrong APN typically allows voice calls but blocks mobile data.
- Li-ion Voltage Range
- A lithium-ion cell is nominally about 3.7 V, fully charged at about 4.2 V, and cut off near 3.0 V. Operating outside this range damages the cell or triggers protection.
- CC/CV Charging
- The standard lithium charging profile: constant current until the cell reaches its full voltage, then constant voltage with tapering current until charge completes.
- Swollen Battery
- A lithium cell that has expanded due to gas buildup, often from age, heat, or overcharge. It must never be charged or punctured; isolate it and dispose through e-waste channels.
- ESD Wrist Strap
- A conductive strap worn on the wrist and connected to ground through a resistor. It safely bleeds static charge from the technician, protecting sensitive components from electrostatic discharge damage.
- Anti-Static Packaging
- Bags or foam that prevent static buildup around sensitive parts. Plain plastic bags generate and hold charge, so boards and ICs must never be stored in them.
- Lithium Fire Response
- Burning lithium cells require a lithium-rated or Class D extinguisher. Water can worsen or spread the reaction, and the cell should be isolated and allowed to cool under supervision.
- Repair Job Sheet
- A written record of device condition, reported fault, agreed price, and customer signature. It protects both shop and customer and documents warranty terms.
- Warranty Terms
- A written statement of warranty duration, what is covered (parts versus labor), and exclusions such as water or physical damage. Clear terms reduce disputes and build trust.